Integrated circuit package system with image sensor system

ABSTRACT

An integrated circuit package system is provided including providing a wafer including image sensor systems having interconnects connected thereto and encapsulating the image sensor systems and interconnects in a transparent encapsulant. The system includes removing a portion of the transparent encapsulant to expose portions of the interconnects and singulating the wafer to form image sensor devices including at least one of the image sensor systems and a number of the interconnects.

CROSS-REFERENCE TO RELATED APPLICATION(S)

The present application contains subject matter related to aconcurrently filed U.S. patent application by Soo-San Park, Hyeog ChanKwon, Sang-Ho Lee, and Jong-Wo Ha entitled “INTEGRATED CIRCUIT PACKAGESYSTEM INCLUDING STACKED DIE”. The related application is assigned toSTATS ChipPAC Ltd. and is identified by docket number 27-165. Thesubject matter thereof is hereby incorporated by reference thereto.

The present application also contains subject matter related to aconcurrently filed U.S. patent application by Seng Guan Chow and HeapHoe Kuan entitled “Multi-chip package system”. The related applicationis assigned to STATS ChipPAC Ltd. and is identified by docket number27-175. The subject matter thereof is hereby incorporated by referencethereto.

The present application also contains subject matter related to aconcurrently filed U.S. patent application by IL Kwon Shim, Byung JoonHan, Kambhampati Ramakrishna, and Seng Guan Chow entitled “EncapsulantCavity Integrated Circuit Package System”. The related application isassigned to STATS ChipPAC Ltd. and is identified by docket number27-141. The subject matter thereof is hereby incorporated by referencethereto.

TECHNICAL FIELD

The present invention relates generally to integrated circuit packagesystems, and more particularly to an image sensor package system.

BACKGROUND ART

In the electronics industry, as products such as cell phones andcamcorders become smaller and smaller, increased miniaturization ofintegrated circuit (IC) packages has become more and more critical. Atthe same time, higher performance and lower cost have become essentialfor new products.

In these assemblies, an image sensor was located within a housing, whichsupported a window. Radiation passed through the window and struck theimage sensor, which responded to the radiation.

Also in these assemblies, an image sensor was mounted to a substrate.After the image sensor was mounted, a housing was mounted around theimage sensor and to the substrate. This housing provided a hermetic likebarrier around the image sensor, while at the same time, supported awindow above the image sensor.

As the technology moves to smaller and lighter weight electronicdevices, it has become increasingly important that the size of the imagesensor assembly used within these electronic devices is reduced.Unfortunately, conventional image sensor assemblies require a housing tosupport the window and to hermetically seal the image sensor and thesehousings are relatively bulky and extend upwards from the substrate asignificant distance.

In addition, mounting these housings at the substrate level isinherently labor intensive and makes repair or replacement of the imagesensors difficult. In particular, removal of the housing exposes theimage sensor to the ambient environment. Since the image sensor issensitive to dust as well as other environmental factors, it isnecessary to make repairs or replacement of the image sensors in acontrolled environment, such as a clean room. Otherwise, there was arisk of damaging or destroying the image sensor.

Since neither of these alternatives is desirable and both are expensive,there has been a long felt need for an image sensor assembly, which issimple to manufacture and service so that costs associated with theimage sensor assembly are minimized.

A solution has been the development of a completely encapsulated imagesensor packages. However, encapsulated image sensor packages typicallyrequire a custom-made mold chase to pre-form a package cavity forhousing the image sensor. The drawback of such custom-made mold chasesis their high cost of manufacture.

Further, encapsulated image sensor packages require the use ofcustom-made substrates, which also have a high manufacturing cost.

Even further, the fabrication methods used to fabricate the image sensorpackage involve a relatively large number of processes.

Solutions to these problems have been long sought, but priordevelopments have not taught or suggested any solutions and, thus,solutions to these problems have long eluded those skilled in the art.

DISCLOSURE OF THE INVENTION

The present invention provides an integrated circuit package systemincluding providing a wafer including image sensor systems havinginterconnects connected thereto and encapsulating the image sensorsystems and interconnects in a transparent encapsulant. The systemincludes removing a portion of the transparent encapsulant to exposeportions of the interconnects and singulating the wafer to form imagesensor devices including at least one of the image sensor systems and anumber of the interconnects.

Certain embodiments of the invention have other aspects in addition toor in place of those mentioned or obvious from the above. The aspectswill become apparent to those skilled in the art from a reading of thefollowing detailed description when taken with reference to theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of an image sensor wafer in accordancewith an embodiment of the present invention;

FIG. 2 is the structure of FIG. 1 in a grinding step;

FIG. 3 is the structure of FIG. 2 in a singulation tape lamination step;

FIG. 4 is the structure of FIG. 3 in a notching step;

FIG. 5 is the structure of FIG. 4 in a singulation step;

FIG. 6 is a cross-sectional view of one of the image sensor devices;

FIG. 7 is a cross-sectional view of an image sensor package inaccordance with a first embodiment of the present invention;

FIG. 8 is a cross-sectional view of an image sensor package inaccordance with a second embodiment of the present invention;

FIG. 9 is a cross-sectional view of an image sensor package inaccordance with a third embodiment of the present invention;

FIG. 10 is a cross-sectional view of an image sensor package inaccordance with a fourth embodiment of the present invention;

FIG. 11 is a cross-sectional view of an image sensor package inaccordance with a fifth embodiment of the present invention; and

FIG. 12 is a flow chart of an integrated circuit package system forfabricating an integrated circuit package including an image sensordevice in accordance with an embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

In the following description, numerous specific details are given toprovide a thorough understanding of the invention. However, it will beapparent that the invention may be practiced without these specificdetails. In order to avoid obscuring the present invention, somewell-known circuits, system configurations, and process steps are notdisclosed in detail.

Likewise, the drawings showing embodiments of the device aresemi-diagrammatic and not to scale and, particularly, some of thedimensions are for the clarity of presentation and are shown greatlyexaggerated in the drawing FIGS. Generally, the device can be operatedin any orientation. The same numbers are used in all the drawing FIGS.to relate to the same elements.

The term “horizontal” as used herein is defined as a plane parallel tothe conventional plane or surface of the wafer, regardless of itsorientation. The term “vertical” refers to a direction perpendicular tothe horizontal as just defined. Terms, such as “on”, “above”, “below”,“bottom”, “top”, “side” (as in “sidewall”), “higher”, “lower”, “upper”,“over”, and “under”, are defined with respect to the horizontal plane.

The term “processing” as used herein includes deposition of material orphotoresist, patterning, exposure, development, etching, cleaning,and/or removal of the material or photoresist as required in forming adescribed structure.

Referring now to FIG. 1, therein is shown a cross-sectional view of animage sensor wafer 100 in accordance with an embodiment of the presentinvention. The image sensor wafer 100 includes a wafer 102, made of amaterial such as silicon, with a top surface 104 and a bottom surface106. A number of integrated circuits 103 are formed in and on the wafer102.

A number of photosensitive structures 112 are formed on the wafer 102over the integrated circuits 103 and connected to the integratedcircuits to form image sensor systems 113. The image sensor system 113is connected to electrical connections or interconnects 110 forelectrical connections off of the image sensor wafer 100. Theinterconnects 110 are connective structures such as solder bumps, solderballs, conductive pillars, etc.

A number of saw streets 114 are formed into a portion of the top surface104 of the wafer 102 to cordon off the photosensitive structures 112.

A transparent encapsulating material 108, such as transparent epoxy, isapplied on the top surface 104 of the wafer 102 by spinning, molding, ora number of other processes to cover and encapsulate the interconnects110 and the photosensitive structures 112. The transparent encapsulatingmaterial 108 is transparent to the radiation, such as light, which thephotosensitive structures 112 sense.

Referring now to FIG. 2, therein is shown the structure of FIG. 1 in agrinding step in accordance with an embodiment of the present invention.The bottom surface 106 of the wafer 102 is planarized to a specifiedsurface flatness and thickness. In accordance with one embodiment, thebottom surface 106 is planarized by grinding using a grinding wheel 202.

The planarization permits the wafer 102 to be extremely thin butpartially supported for strength by the transparent encapsulatingmaterial 108 so it may be safely handled. This extreme thinness alsohelps reduce the package profile.

Referring now to FIG. 3, therein is shown the structure of FIG. 2 on asingulation tape lamination step in accordance with an embodiment of thepresent invention. The wafer 102 is mounted on a singulation tape 302enclosed within a mounting frame 304.

Referring now to FIG. 4, therein is shown the structure of FIG. 3 in anotching step in accordance with an embodiment of the present invention.A portion of the transparent encapsulating material 108 and a portion ofthe interconnects 110 are notched by a process such as etching or sawcutting. For example, thick saw blades 402 may be used for creating sawnotches 404 of width “W” on a portion of the surface of the transparentencapsulating material 108 such that it exposes a portion of theinterconnects 110. The saw notches 404 of FIG. 4 form recesses into theedges of the transparent encapsulating material 108 partially exposing aportion of the interconnects 110. The saw notches 404 reduce thethickness of the transparent encapsulating material 108, which must besawn or lasered for singulation, while the transparent encapsulatingmaterial 108 helps prevent edge defects or breakage during thesingulation operation.

Referring now to FIG. 5, therein is shown the structure of FIG. 4 in asingulation step in accordance with an embodiment of the presentinvention. The singulation step, which divides a wafer into a number ofindividual dies, can be performed in a number of different ways. Forexample, a singulation saw 502 may be used for cutting through the wafer102 and the transparent encapsulating material 108 to create a cut 504of width “w” at the saw streets 114 between each die structure to yielda number of image sensor devices 505.

Referring now to FIG. 6, therein is shown a cross-sectional view of oneof the image sensor devices 505. The image sensor device 505, as a unit,includes an integrated circuit die 602, at least image sensor system113, a number of interconnects 110, and a transparent encapsulant 604.

The image sensor device 505 can be one of a number of different types ofdevices depending on the photosensitive structure 112. For example, theimage sensor device 505 could be a charge coupled device (CCD) orcomplementary metal-oxide semiconductor (CMOS) image sensor device.

The transparent encapsulant 604 is of a clear and optically transparentmaterial for the transmission of light waves to the photosensitivestructure 112. The transparent encapsulant 604 has a number of notches606, which are formed into at least one edge of the transparentencapsulant 604. In a quad-package, the notches 606 are on all foursides of the transparent encapsulant 604 for electrical connection tothe integrated circuit die 602 and photosensitive structure.

The interconnects 110 are on the integrated circuit die 602 and may bemanufactured from any electrically conductive material such as Pb, PbSn,PbSnAg, or Au. The interconnects 110 can have any shape such as aspherical, pillar, or stud shape.

It will be understood that when the integrated circuit die 602 ispositioned with the transparent encapsulant 604 on top, thephotosensitive structure 112 senses radiation from above between theinterconnects 110. In this position, the image sensor device 505 isconsidered to be face up and, conversely, when the transparentencapsulant 604 is on the bottom, the image sensor device 505 isconsidered to be face down. In both positions, the top surface of thetransparent encapsulant 604 between the interconnects 110 must only becovered, if it is covered, by a similarly transparent material.

Referring now to FIG. 7, therein is shown a cross-sectional view of animage sensor package 700 in accordance with a first embodiment of thepresent invention. The image sensor package 700 includes a substrate702, the image sensor device 505, and a partially encapsulating moldcompound 706.

The substrate 702 includes a base material 708 sandwiched between a topcircuit layer 710 and a bottom circuit layer 712. The base material 708can also be a rigid epoxy glass resin fiber composite, a flexible tape,a ceramic, or a leadframe.

A number of vias 714 electrically connect the top circuit layer 710 andthe bottom circuit layer 712. Board connectors such as solder balls 716are mounted to the bottom circuit layer 712 electrically connecting someof the vias 714.

The integrated circuit die 602 is attached to the top circuit layer 710with an adhesive 718. The interconnects 110 are electrically connectedto wire-bond pads 720 in the bottom circuit layer 712 with anelectrically conductive bonding wires 722. Wire-bonding technique can beused to establish the electrical connection between the interconnects110 and the wire-bond pads 720 on the base material 708. Optionally,tape automated bonding (TAB) technique can be used to establish theelectrical connection between the interconnects 110 and the wire-bondpads 720 on the base material 708.

The image sensor package 700 can be assembled with the image sensordevice 505 attached to a top side of the substrate 702. The image sensorpackage 700 can be configured as a SiP, MCM or stacked-die packageformat. A film-assist molding technique can be used to mold the topsurface of the encapsulating mold compound 706 flush with the topsurface of the transparent encapsulant 604 without the occurrence ofmold flash.

Referring now to FIG. 8, therein is shown a cross-sectional view of animage sensor package 800 in accordance with a second embodiment of thepresent invention. The image sensor package 800 includes a substrate 802having an aperture 803 and the image sensor device 505 disposed withinthe aperture 803. The image sensor device 505 is partially encapsulatedwithin a mold compound 806.

The substrate 802 includes a base material 808 sandwiched between a topcircuit layer 810 and a bottom circuit layer 812. The base material 808can be a rigid epoxy glass resin fiber composite, a flexible tape, aceramic, or a leadframe.

A number of vias 814 electrically connect wire-bond pads 824 at the topcircuit layer 810 and solder pads 818 at the bottom circuit layer 812.Board connectors such as solder balls 820 are mounted to the solder pads818 at the bottom circuit layer 812.

The interconnects 110 are electrically connected to interconnectwire-bond pads 824 in the bottom circuit layer 812 by electricallyconductive bonding wires 822. Wire-bonding technique can be used toestablish the electrical connection between the interconnects 110 andinterconnect wire-bond pads 824 on the base material 808. Optionally,tape automated bonding (TAB) technique can be used to establish theelectrical connection between the interconnects 110 and the wire-bondpads 824 on the base material 808.

The image sensor package 800, having a low profile, can be assembledwith the image sensor device 505 face up within the aperture 803 of thesubstrate 802. The electrically conductive bonding wires 822 may includeshorter wire lengths with the use of a low loop height wire-bondingtechnique and a reduced gap between the interconnects 110 and theinterconnect wire-bond pads 824.

In accordance with another embodiment, a film-assist molding techniquecan be used to mold the final molding compound with top surface flushwith the transparent encapsulant 604 without the occurrence of moldflash.

Referring now to FIG. 9, therein is shown a cross-sectional view of animage sensor package 900 in accordance with a third embodiment of thepresent invention. The image sensor package 900 includes a substrate 902having an aperture 903 and the image sensor device 505 partiallydisposed within the aperture 903 and connected to the substrate 902 witha sealant 906, or bonding material for better mechanical protection andinterconnection integrity.

The substrate 902 includes a base material 908 sandwiched between a topcircuit layer 910 and bottom circuit layer 912. The base material 908can be a rigid epoxy glass resin fiber composite, a flexible tape, aceramic, or a leadframe.

A number of vias 914 electrically connect the top circuit layer 910 tothe bottom circuit layer 912. A number of substrate connectors such assolder balls 916 are mounted to solder pads 918 in the bottom circuitlayer 912. A passive or active device 920 is mounted to solder pads 922in the top circuit layer 910. Other additional passive devices or activedevices may also be mounted on or integrated on the top circuit layer910.

The interconnects 110 are electrically connected to interconnect solderpads 924 in the bottom circuit layer 912 with electrical connections926, such as a solder joint, an intermetallic layer, or an adhesivelayer. The electrical connections 926 may be established using an SMTtechnique, an ultrasonic bonding technique, or a dot dispensingtechnique.

The image sensor package 900, having a low profile, can be assembledwith the image sensor devices 505 face up within the aperture 903 of thesubstrate 902. The transparent encapsulant 604 protrudes through theaperture 903.

In accordance with another embodiment, a mold compound (not shown) or aglob-top material can be formed beneath the base material 908 to coverthe image sensor device 505. In addition, the mold compound or glob-topmaterial can also be formed to cover the peripheral region of the basematerial 908.

Referring now to FIG. 10, therein is shown a cross-sectional view of animage sensor package 1000 in accordance with a fourth embodiment of thepresent invention. The image sensor package 1000 includes a substrate1002 having an aperture 1003 and the image sensor device 505 partiallydisposed within the aperture 1003 and connected to the substrate 1002with a sealant 1026, or bonding material for better mechanicalprotection and interconnection integrity. The image sensor device 505 ispartially encapsulated within a mold compound 1006.

The substrate 1002 includes a base material 1008 sandwiched between atop circuit layer 1010 and a bottom circuit layer 1012. The basematerial 1008 can include a rigid epoxy glass resin fiber composite, aflexible tape, a ceramic, or a leadframe.

A number of vias 1014 electrically connect the top circuit layer 1010 tothe bottom circuit layer 1012. A number of board connectors such assolder balls 1016 are mounted to solder pads 1018 in the bottom circuitlayer 1012. A passive device 1020 is mounted to the top circuit layer1010 and is also encapsulated within the mold compound 1006. Otheradditional passive devices or active devices may also be mounted on orintegrated on the top circuit layer 1010.

The interconnects 110 are electrically connected to electrical contactpads 1022 in the top circuit layer 1010 with an electricalinterconnection 1024. The electrical interconnection 1024 may beestablished using an SMT technique, an ultrasonic bonding technique, ora dot dispensing technique.

The image sensor package 1000, having a low profile, can be assembledwith the image sensor devices 505 face down within the aperture 1003 ofthe substrate 1002.

Referring now to FIG. 11, therein is shown a cross-sectional view of animage sensor package 1100 in accordance with a fifth embodiment of thepresent invention.

The image sensor package 1100 includes a substrate 1102, a first imagesensor device 1104 and a second image sensor device 1106, both similarto the image sensor device 505. The first image sensor device 1104 andthe second image sensor device 1106 are partially encapsulated within aliquid encapsulant material 1128 limited by a dam 1109. The substrate1102 includes a base material 1108 sandwiched between a top circuitlayer 1110 and a bottom circuit layer 1112. The base material 1108 canbe a rigid epoxy glass resin fiber composite, a flexible tape, aceramic, or a leadframe.

A number of vias 1114 electrically connect the top circuit layer 1110and the bottom circuit layer 1112. A number of substrate connectors suchas solder balls 1116 are mounted to the bottom circuit layer 1112.

The first image sensor device 1104 and the second image sensor device1106 are attached to the top circuit layer 1110 with an adhesive 1120.The interconnects 110 are electrically connected to the top circuitlayer 1110 with electrically conductive bonding wires 1122.

The first image sensor device 1104 and the second image sensor device1106 can be encapsulated together using a dam-and-fill method where theliquid encapsulant material 1128 fills the dam 1109 to just before thetop surface of the transparent encapsulant 604 is covered. The liquidencapsulant material 1128 is then cured to a solid form.

Referring now to FIG. 12, therein is shown a flow chart of an integratedcircuit package system 1200 for fabricating an integrated circuitpackage 700 including an image sensor device 505 in accordance with anembodiment of the present invention. The system 1200 includes providinga wafer including image sensor systems having interconnects connectedthereto in a block 1202; encapsulating the image sensor systems andinterconnects in a transparent encapsulant in a block 1204; removing aportion of the transparent encapsulant to expose portions of theinterconnects in a block 1206; and singulating the wafer to form imagesensor devices including at least one of the image sensor systems and anumber of the interconnects in a block 1208.

In greater detail, a method for fabricating an image sensor structure,according to an embodiment of the present invention, is performed asfollows:

-   -   1. providing an image sensor wafer. (FIG. 1)    -   2. grinding a bottom side of the image sensor wafer. (FIG. 2)    -   3. mounting the image sensor wafer on a singulation tape. (FIG.        3)    -   4. cutting through a portion of the image sensor wafer with        thick blades of width “W” to expose the interconnects. (FIG. 4)    -   5. cutting through the image sensor wafer mold with thin blades        of width “w” to singulate the image sensor wafer into individual        single image sensor devices. (FIG. 5)

It has been discovered that the present invention thus has numerousaspects.

An aspect is that the present invention includes a transparentencapsulating material that can serve as a protective layer for the chipphotosensitive area and chip interconnects from the wafer back grindingprocess and assembly handling. The transparent encapsulating materialcan serve as a stiffener to prevent the occurrence of wafer warpage. Thetransparent encapsulating material allows the saw street (or saw scribeline) recognition for high accuracy singulation process. The transparentencapsulating material can serve as a buffer to prevent the die edgesfrom chipping during notching and singulation. It also can serve as ahermetic sealant to prevent moisture ingression and contamination to thechip photosensitive area. The transparent encapsulating material furtherserves as a protective layer to prevent the liquid encapsulant materialcontaminating the chip photosensitive area when the dam-and-fill methodis adopted to form the optical packages. The transparent encapsulatingmaterial can still further serve as an optical window to allow a clearimage of the radiation impinging on the chip photosensitive area. Theclear encapsulant allows the wafer level molding process to be adoptedto improve productivity and lower manufacturing cost.

In contrast with prior arts, the present invention does not require thecustomized mold chase design in which a protruding part is required inorder to make a cavity for depositing an optical transparent encapsulantand/or mounting an optical glass lid atop. An additional optical lens(not shown in embodiments) can be added on top of the transparentencapsulating material for better light focus of filter capability. Aheat sink and/or shield member (not shown) can be attached to thepackage structure illustrated in FIG. 10 for better thermal managementand/or EMI suppression.

While the invention has been described in conjunction with a specificbest mode, it is to be understood that many alternatives, modifications,and variations will be apparent to those skilled in the art in light ofthe aforegoing description. Accordingly, it is intended to embrace allsuch alternatives, modifications, and variations which fall within thescope of the included claims. All matters hithertofore set forth hereinor shown in the accompanying drawings are to be interpreted in anillustrative and non-limiting sense.

1. An integrated circuit package system comprising: providing a waferincluding image sensor systems having interconnects connected thereto;encapsulating the image sensor systems and the interconnects in atransparent encapsulant; removing a portion of the transparentencapsulant to expose portions of the interconnects; and singulating thewafer to form image sensor devices including at least one of the imagesensor systems and a number of the interconnects.
 2. The system asclaimed in claim 1 further comprising: providing a substrate; andmounting at least one of the image sensor devices on the substrate withthe number of the interconnects connected to the substrate.
 3. Thesystem as claimed in claim 1 further comprising: providing a substratehaving an aperture provided therein; and mounting at least one of theimage sensor devices at least partially in the aperture with the numberof interconnects connected to the substrate.
 4. The system as claimed inclaim 1 further comprising: providing a substrate having an apertureprovided therein and substrate connectors on the bottom thereof; andmounting at least one of the image sensor devices at least partially inthe aperture and among the substrate connectors with the number ofinterconnects connected to the substrate.
 5. The system as claimed inclaim 1 further comprising: providing a substrate having a dam aroundthe periphery thereof; mounting at least one of the image sensor deviceson the substrate with the number of the interconnects connected to thesubstrate; and filling the dam with a liquid encapsulant material aroundthe at least one of the image sensor devices.
 6. The system as claimedin claim 1 wherein: removing the portion of the transparent encapsulantincludes notching the transparent encapsulant to expose the portion ofthe interconnects; and grinding the bottom of the wafer.
 7. The systemas claimed in claim 6 further comprising: providing a substrate;mounting at least one of the image sensor devices face up on thesubstrate with the number of the interconnects connected to thesubstrate by bonding wires; and encapsulating the bonding wires.
 8. Thesystem as claimed in claim 6 further comprising: providing a substratehaving an aperture provided therein; mounting at least one of the imagesensor devices face up or face down at least partially in the aperturewith the number of interconnects connected to the substrate by bondingwires or electrical connections; and encapsulating the bonding wires. 9.The system as claimed in claim 6 further comprising: providing asubstrate having an aperture provided therein and board substrateconnectors on the bottom thereof; mounting at least one of the imagesensor devices face up at least partially in the aperture and among thesubstrate connectors with the number of interconnects connected to thesubstrate by bonding wires or electrical connections; and encapsulatingthe bonding wires.
 10. The system as claimed in claim 6 furthercomprising: providing a substrate having a dam around the peripherythereof; mounting at least one of the image sensor devices on thesubstrate with the number of the interconnects connected to thesubstrate by bonding wires; filling the dam with a liquid encapsulantmaterial to cover the bonding wires; and solidifying the liquidencapsulant material.
 11. An integrated circuit package systemcomprising: an integrated circuit die including an image sensor systemhaving interconnects connected thereto; and a transparent encapsulant onthe integrated circuit die and encapsulating the image sensor system andthe interconnects, the transparent encapsulant having a portion of thetransparent encapsulant removed to expose portions of the interconnectsand to comprise an image sensor device.
 12. The system as claimed inclaim 11 further comprising: a substrate; and the image sensor devicemounted on the substrate with the interconnects connected to thesubstrate.
 13. The system as claimed in claim 11 further comprising: asubstrate having an aperture provided therein; and the image sensordevice mounted on the substrate at least partially in the aperture withthe interconnects connected to the substrate.
 14. The system as claimedin claim 11 further comprising: a substrate having an aperture providedtherein and board substrate connectors on the bottom thereof; and theimage sensor device mounted on the substrate at least partially in theaperture and among the substrate connectors with the interconnectsconnected to the substrate.
 15. The system as claimed in claim 11further comprising: a substrate having a dam around the peripherythereof; the image sensor device mounted on the substrate with theinterconnects connected to the substrate; and a liquid encapsulantmaterial around the image sensor device and filling the dam.
 16. Anintegrated circuit package system comprising: an integrated circuit dieincluding image sensor systems having interconnects connected thereto;and a transparent encapsulant encapsulating the image sensor systems andthe interconnects in a transparent encapsulant, the transparentencapsulant having a notch to expose portions of the interconnects andto comprise an image sensor device.
 17. The system as claimed in claim16 further comprising: a substrate having passive or active deviceselectrically connected thereto; the image sensor device mounted face upon the substrate with the interconnects connected to the substrate bybonding wires; and an encapsulant encapsulating the bonding wires. 18.The system as claimed in claim 16 further comprising: a substrate havingpassive or active devices electrically connected thereto and having anaperture provided therein; the image sensor device mounted face up orface down at least partially in the aperture with the interconnectsconnected to the substrate by bonding wires or electrical connections;and an encapsulant encapsulating the bonding wires.
 19. The system asclaimed in claim 16 further comprising: a substrate having passive oractive devices electrically connected thereto and having an apertureprovided therein and substrate connectors on the bottom thereof; theimage sensor device mounted face up at least partially in the apertureand among the substrate connectors with the interconnects connected tothe substrate by bonding wires or electrical connections; and anencapsulant encapsulating the bonding wires.
 20. The system as claimedin claim 16 further comprising: a substrate having a dam around theperiphery thereof; the image sensor device mounted on the substrate withthe interconnects connected to the substrate by bonding wires; and asolidified liquid encapsulant material in the dam to cover the bondingwires.